Θερμοαγώγιμο pad Iceberg Thermal DRIFTIce

The Iceberg Thermal DRIFTIce thermal pad provides a reliable thermal interface with a conductivity of 13 W/m·K. Supplied in a 40 mm x 120 mm x 0.5 mm format and finished in grey, this pad is intended for filling air gaps between heat-generating components and heatsinks to improve heat transfer without hardening or corroding over time.

Advantages

DRIFTIce offers high thermal conductivity (13 W/m·K) for effective heat transfer, a flexible composition that remains stable over years, and compatibility with various component types. The pad is available in multiple sizes and thicknesses so you can select the exact thickness required for precise contact and gap filling. It is supplied as a single grey pad sized 40 × 120 × 0.5 mm.

Suitable for

• VGA/graphics card gap filling
• RAM modules and memory cooling
• Notebook and laptop internal component thermal management
• Other electronics requiring a soft thermal interface

Key specifications

• Thermal conductivity: 13 W/m·K
• Dimensions: 40 mm × 120 mm × 0.5 mm
• Operating temperature range: -40 °C to 200 °C
• Colour: Grey
• Package quantity: 1 piece
• Manufacturer MPN: DRIFTICE05-B0A
• EAN: 1230000071369

How to use

Clean both mating surfaces thoroughly to remove dust, grease, and old thermal material. Cut the pad to the required shape and size if needed, peel off the protective film, and place the pad so it makes even contact between the component and the heatsink. Reassemble the device and verify that contact pressure is uniform to ensure effective heat transfer.

Recommendations

For best results, choose the pad thickness that matches the gap to avoid excessive compression or insufficient contact. Avoid stretching the pad when cutting or fitting, and ensure surfaces are aligned before final assembly.