Θερμοαγώγιμο pad DeLOCK 18484 3 W/m·K ροζ 20x120x3 mm

The DeLOCK 18484 thermal pad is a silicone-free conductive pad designed to improve heat dissipation in electronic components. With a thermal conductivity of 3 W/m·K and dimensions of 20 x 120 x 3 mm, the pink pad is suitable for applications such as M.2 modules and other compact assemblies where efficient thermal transfer and component protection are required.

Advantages

This silicone-free thermal pad does not release oils that can contaminate sensitive parts, making it appropriate for use with sensors and other delicate electronics. It maintains its properties across a wider temperature range compared with silicone-based pads, supporting durability and stable thermal performance in industrial and optoelectronic environments. The pad’s thermal conductivity of 3 W/m·K enables effective heat transfer to reduce operating temperatures.

Suitable for

• M.2 SSD modules
• Small form-factor PCBs and modules
• Optoelectronic components
• Industrial electronics operating at varying temperatures

Key specifications

• Brand: DELOCK
• Model / MPN: 18484
• Thermal conductivity: 3 W/m·K
• Dimensions (W x D x H): 20 x 120 x 3 mm
• Color: Pink
• Material type: Silicone-free thermal conductive pad
• Packaging: Polybag
• Country of manufacture: China / Taiwan
• EAN: 4043619184842

How to use

Measure and cut the thermal pad to match the contact area on the component and heatsink. Clean mating surfaces to remove dust and grease. Place the pad between the heat source (for example an M.2 module) and the heat spreader or chassis, ensuring even contact without folding. Apply the assembly and secure according to the device’s installation procedure.

Recommendations

Use silicone-free thermal pads like the DeLOCK 18484 when working with sensitive sensors or optoelectronic parts to avoid contamination. Select the pad thickness and contact area to ensure proper compression and good thermal contact; avoid overstretching or excessive compression that could reduce effectiveness.