Θερμοαγώγιμο pad DeLOCK 18481 3 W/m·K Ροζ 20x120x0,5 mm

DeLOCK 18481 is a silicone-free thermal conductive pad with a thermal conductivity of 3 W/m·K, sized 20 x 120 x 0.5 mm. The pink pad is designed to improve heat dissipation on electronic components such as M.2 modules, helping to stabilise performance and extend component service life in applications across industry and optoelectronics.

Advantages

The silicone-free composition prevents the release of oils that could contaminate or damage sensitive components and allows reliable operation across a wider temperature range. The pad offers stable thermal transfer properties, increased durability compared with conventional silicone pads, and reduced risk of contamination for sensors and other sensitive electronics.

Suitable for

• Thermal management of M.2 modules and compact storage devices
• Heat dissipation in industrial electronics and optoelectronic assemblies
• Applications with sensitive sensors or components where silicone contamination must be avoided

Key specifications

• Brand: DELOCK
• Manufacturer part number (MPN): 18481
• EAN: 4043619184811
• Thermal conductivity: 3 W/m·K
• Dimensions: 20 x 120 x 0.5 mm
• Colour: Pink
• Silicone-free thermal pad

How to use

Cut the thermal pad to the required size if necessary, remove any protective liners, and place it between the heat-generating component (for example an M.2 module) and its heatsink or metal contact surface to ensure uniform contact and efficient thermal transfer. Ensure surfaces are clean and free of dust or debris before installation. Do not stretch the pad; apply even pressure when reassembling the device to maintain good contact.

Recommendations

For optimal results, verify thickness suitability for the gap to be filled and avoid exposure to sharp edges. Store the pad in a clean, dry environment and follow manufacturer guidance for operating temperature limits and mechanical mounting to preserve thermal performance and longevity.