Θερμοαγώγιμο pad DeLOCK 18478 3 W/m·K γκρι 20x120x3 mm

The DeLOCK 18478 thermal pad is a grey, solid thermal interface material measuring 20 x 120 x 3 mm with a thermal conductivity of 3 W/m·K. It is designed to improve heat dissipation in electronic assemblies such as M.2 modules, helping to maintain stable operating temperatures and supporting component longevity.

Advantages

The thermal pad offers a consistent thermal conductivity of 3 W/m·K and a precise block shape that fills gaps between heat-generating components and heatsinks. Its dimensions (20 x 120 x 3 mm) make it suitable for compact applications where a reliable thermal interface is required. The neutral grey color and stable material properties enable straightforward installation and predictable thermal performance.

Suitable for

• Thermal bridging on M.2 SSD modules
• Heat transfer between PCBs and heatsinks in small form-factor devices
• Filling gaps in cooling assemblies for laptops, mini-PCs, and embedded systems

Key specifications

• Brand: DELOCK
• Model / MPN: 18478
• EAN: 4043619184781
• Thermal conductivity: 3 W/m·K
• Colour: Grey
• Dimensions: 20 x 120 x 3 mm (W x D x H)
• Category: Computer components accessories

How to use

Measure the area to be cooled and cut the thermal pad to the required shape and size if necessary. Clean contact surfaces to remove dust, oils or residues. Place the pad between the heat source (for example an M.2 module) and the heatsink or chassis contact area, ensuring even contact and no trapped air pockets. Apply gentle, even pressure to seat the pad. Reassemble the device according to the manufacturer’s instructions.

Recommendations

For reliable results, use the pad within typical PC operating temperature ranges and verify that the pad thickness (3 mm) matches the gap to be filled. Avoid stretching or tearing the pad during cutting and installation. Refer to the device manufacturer’s guidance for clearance and mounting requirements when working with M.2 modules and other sensitive components.