Θερμοαγώγιμο pad DeLOCK 18475 3 W/m·K γκρι 20x120x0,5 mm

The DeLOCK 18475 thermal pad provides a thermal conductivity of 3 W/m·K and is designed for heat dissipation in electronic devices such as M.2 modules. It is grey, measures 20 x 120 x 0.5 mm and is supplied in a polybag. The pad facilitates heat transfer between components and heatsinks to help maintain operating temperatures and support component longevity.

Advantages

The thermal pad offers a clear thermal conductivity rating of 3 W/m·K and a thin 0.5 mm profile that fits in tight gaps. Its rectangular 20 x 120 mm size covers a range of small form-factor applications. The material is supplied in grey and packaged in a polybag for convenient handling and storage.

Suitable for

• Heat dissipation on M.2 SSD modules
• Thermal interface between small PCBs and heatsinks
• Filling thin gaps in electronic assemblies

Key specifications

• Brand: DELOCK
• Model/MPN: 18475
• EAN: 4043619184750
• Thermal conductivity: 3 W/m·K
• Dimensions: 20 x 120 x 0.5 mm
• Color: Grey
• Packaging: Polybag
• Manufactured in: China / Taiwan

How to use

Clean the surfaces to be joined, removing dust, grease and old thermal compound. Cut or trim the thermal pad to the required size if necessary. Place the pad between the heat-generating component (for example an M.2 SSD) and the heatsink or chassis contact area, ensuring full contact without trapping air. Reassemble the device and secure any mounting hardware to maintain consistent pressure across the pad.

Recommendations

Do not overstretch or compress the pad beyond its intended thickness; verify compatibility with component tolerances and ensure the pad does not short electrical contacts. For optimal results, confirm the pad thickness and thermal conductivity meet the device cooling requirements.