Θερμοαγώγιμο pad DeLOCK 18471 3,2 W/m·K γκρι 20x120x3 mm

The DeLOCK 18471 thermal pad is a grey thermal interface material with a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 3 mm. Designed for electronic components, it improves heat dissipation for devices such as M.2 modules and helps maintain performance and component lifetime. The pad is supplied in a polybag and is manufactured in China and Taiwan.

Advantages

The pad offers efficient heat transfer due to its 3.2 W/m·K thermal conductivity and fits narrow form-factor applications thanks to its 20 x 120 x 3 mm size. It features low oil bleeding, which reduces contamination of electronic contacts and helps preserve the pad’s thermal and mechanical properties for more stable long-term heat dissipation.

Suitable for

• M.2 SSD modules
• Small-format heat-spreading between chips and heatsinks
• Cooling gaps in compact computer components and accessories

Key specifications

• Brand: DELOCK
• Model / MPN: 18471
• EAN: 4043619184712
• Thermal conductivity: 3.2 W/m·K
• Colour: Grey
• Dimensions: 20 x 120 x 3 mm (W x D x H)
• Packaging: Polybag
• Manufactured in: China, Taiwan

How to use

Cut the thermal pad to the required shape if necessary and peel off any protective liners before placement. Place the pad between the heat source (for example an M.2 SSD) and the heatsink or metal contact area, ensuring full surface contact without trapped air. Reassemble the device and apply even mounting pressure so the pad conforms to component surfaces for optimal thermal transfer.

Recommendations

Store the thermal pad in a dry, dust-free environment away from direct sunlight. Avoid stretching the pad during installation and replace it if it becomes compressed or contaminated to maintain effective thermal performance.