Θερμοαγώγιμο pad DeLOCK 18403 3,2 W/m·K Γκρι 20x70x0,75 mm

The DeLOCK 18403 thermal pad is a grey heat-conductive pad with a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 70 x 0.75 mm. It is designed to improve heat dissipation from electronic components such as M.2 modules, helping to stabilise performance and extend component lifespan. The pad is supplied in a polybag and features low oil bleeding to minimise contamination of contacts and surrounding parts.

Advantages

The pad provides efficient thermal transfer with a rated thermal conductivity of 3.2 W/m·K while maintaining mechanical stability. Its low oil bleeding formulation reduces the risk of contaminating electronic contacts and components, preserving thermal and mechanical properties over time and contributing to consistent heat dissipation.

Suitable for

• Heat dissipation on M.2 SSD modules
• Thermal coupling between chips and heatsinks in compact electronics
• Applications where low contamination of contacts is required

Key specifications

• Brand: DELOCK
• Model / MPN: 18403
• EAN: 4043619184033
• Thermal conductivity: 3.2 W/m·K
• Dimensions: 20 x 70 x 0.75 mm
• Colour: Grey
• Packaging: Polybag

How to use

Clean the surfaces to be joined, ensuring they are free of dust, grease and residues. Cut the thermal pad to the required shape if necessary, remove the protective liners and place the pad between the heat-generating component (for example an M.2 module) and the heatsink or metal contact surface. Apply even pressure to ensure full contact and avoid air gaps.

Recommendations

For best results, verify component compatibility and recommended thickness for your application. Avoid stretching or compressing the pad excessively; replace the pad if it becomes damaged or loses elasticity.