Θερμοαγώγιμο pad Gelid TP-GP04-R-E 120×20×3,0 mm, πυκνότητα 3,2 g/cm³, 1 τεμ.

Thermal pad Gelid TP-GP04-R-E is a soft thermal interface pad sized 120×20×3.0 mm with a density of 3.2 g/cm³. Supplied as a single piece, the pad fills gaps up to 3 mm and creates a compliant thermal connection between electronic components and heatsinks to improve heat transfer in PCs and other electronic devices. Do not open the product or attempt to repair it yourself.

Advantages

The thermal pad provides gap filling up to its 3.0 mm thickness and a consistent thermal path thanks to its specified density. Its pre-cut dimensions simplify installation in narrow spaces and single-piece packaging reduces waste and handling. The soft material conforms to uneven surfaces, improving contact between components and heatsinks for more reliable cooling performance.

Suitable for

• Thermal interface between chips, controllers or memory modules and heatsinks in PCs
• Gap filling in compact electronic assemblies where a 3.0 mm thickness is required
• Repair or upgrade tasks that require a compliant thermal pad for improved heat transfer

Key specifications

• Type: thermal pad
• Dimensions: 120 × 20 × 3.0 mm
• Material density: 3.2 g/cm³
• Quantity: 1 piece per pack

How to use

Clean and dry contact surfaces before application. Remove protective liners and place the thermal pad between the component and the heatsink, ensuring full contact across the pad area. Apply gentle pressure to seat the pad and secure the heatsink according to the device’s assembly instructions. Ensure the pad thickness matches the gap to avoid excessive compression or insufficient contact.

Recommendations

Do not open the product or attempt to repair it yourself. Store in a cool, dry place and avoid contamination of the contact surfaces prior to installation.