Θερμοαγώγιμο pad DeLOCK 18483 3 W/m·K Ροζ 20x120x2 mm

The DeLOCK 18483 thermal pad is a silicone-free thermal interface material with a thermal conductivity of 3 W/m·K and dimensions of 20 x 120 x 2 mm. Designed for heat dissipation in electronic components such as M.2 modules, the pad aims to improve thermal transfer, maintain device performance and extend component lifespan. The pad is pink and supplied in a polybag; it is manufactured in China.

Advantages

Being silicone-free, this thermal pad does not release oils that can contaminate or damage sensitive components. It maintains stable properties across a wider temperature range compared with silicone-based pads, making it suitable for industrial or optoelectronic applications. The pad’s composition supports reliable long-term thermal contact and reduces the risk of component failure due to overheating.

Suitable for

• Heat dissipation on M.2 SSD modules
• Thermal interface in compact electronic assemblies
• Industrial electronics and optoelectronic devices
• Applications requiring silicone-free materials (e.g., sensors)

Key specifications

• Brand: DELOCK
• Model / MPN: 18483
• EAN: 4043619184835
• Thermal conductivity: 3 W/m·K
• Dimensions: 20 x 120 x 2 mm
• Color: Pink
• Material type: Silicone-free thermal pad
• Packaging: Polybag
• Country of manufacture: China

How to use

Clean both mating surfaces to remove dust, grease or residues. Cut the pad to the required shape and size if necessary, then place it between the heat-generating component (for example an M.2 module) and the heatsink or chassis contact area. Apply even pressure to ensure full contact and avoid air gaps. Follow the device manufacturer’s instructions for reassembly and torque settings where applicable.

Recommendations

If used in sensor assemblies or other devices sensitive to outgassing, choose this silicone-free pad to minimise contamination risks. Verify compatibility with operating temperature ranges and mechanical constraints in your application before installation.