Θερμοαγώγιμο pad DeLOCK 18477 3 W/m·K Γκρι 20x120x2 mm

The DeLOCK 18477 thermal pad is designed to improve heat dissipation in electronic components. With a thermal conductivity of 3 W/m·K and dimensions of 20 x 120 x 2 mm, this grey pad helps transfer heat away from components such as M.2 modules to support stable operation and potentially extend service life. The pad is supplied in a polybag for simple handling and installation.

Advantages

The thermal pad offers a balanced combination of thermal conductivity and mechanical compliance, enabling efficient heat transfer while compensating for small surface irregularities. Its pre-cut rectangular shape and moderate thickness make it suitable for compact assemblies where space is limited. The neutral grey colour and supplied polybag packaging simplify storage and identification.

Suitable for

• Heat dissipation on M.2 modules and SSDs
• Thermal interface between chips and heatsinks in compact devices
• Cooling small electronic assemblies in computers and embedded systems

Key specifications

• Brand: DELOCK
• Model / MPN: 18477
• EAN: 4043619184774
• Thermal conductivity: 3 W/m·K
• Dimensions: 20 x 120 x 2 mm
• Colour: Grey
• Packaging: Polybag

How to use

Ensure both surfaces to be connected are clean and free of dust or grease. Cut the thermal pad to the required size if necessary, remove any protective liners, and place the pad between the heat-generating component (for example an M.2 module) and the heatsink or chassis contact area. Apply gentle pressure to secure contact and ensure even coverage. Verify that the pad does not interfere with connectors or mounting hardware.

Recommendations

Use the pad in applications where contact pressure is sufficient to maintain thermal coupling; avoid using in locations with excessive mechanical stress or movement. If cutting is required, measure carefully to preserve uniform thickness and coverage. Store the product in a dry environment and keep the polybag until installation to prevent contamination.