Θερμοαγώγιμο pad DeLOCK 18476 3 W/m·K γκρι 20x120x1,5 mm

The DeLOCK 18476 thermal pad is a grey, soft thermal interface material with a thermal conductivity of 3 W/m·K and dimensions 20 x 120 x 1.5 mm. It is designed to improve heat transfer between electronic components and heatsinks, for example to assist heat dissipation on M.2 modules, helping to maintain stable performance and prolong component lifetime.

Advantages

The pad provides consistent thermal conductivity of 3 W/m·K and conforms to uneven surfaces to reduce thermal resistance. Its 1.5 mm thickness offers a reliable gap-filling capability for small component-to-heatsink distances. Supplied in grey and packed in a polybag, the pad is easy to handle and cut to size for specific applications.

Suitable for

• Improving heat dissipation on M.2 SSD modules
• Thermal interface between small PCBs and heatsinks
• Filling thermal gaps in compact electronic assemblies

Key specifications

• Brand: DELOCK
• MPN: 18476
• EAN: 4043619184767
• Thermal conductivity: 3 W/m·K
• Colour: Grey
• Dimensions (W x D x H): 20 x 120 x 1.5 mm
• Packaging: Polybag

How to use

Measure the area to be covered and, if necessary, cut the pad to the required size. Clean both surfaces to remove dust and grease before placement. Place the thermal pad between the component (for example an M.2 module) and the heatsink or casing, ensuring full contact without trapped air. Apply even pressure to seat the pad and secure the heatsink or cover according to the device assembly instructions.

Recommendations

Use the pad within its intended temperature range and replace it if it shows signs of compression set, damage, or contamination. Avoid stretching the pad during installation and ensure compatibility with adjacent materials to prevent chemical interactions.