Θερμοαγώγιμο pad DeLOCK 18467 3,2 W/m·K γκρι 20x70x1,75 mm

The DeLOCK 18467 thermal pad is designed to improve heat dissipation in electronic devices such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 70 x 1.75 mm, the grey pad helps stabilise component temperatures and can contribute to longer service life. It is supplied in a polybag and manufactured to limit oil bleeding, reducing the risk of contamination.

Advantages

The thermal pad provides a thermal conductivity of 3.2 W/m·K in a format suitable for compact assemblies. Its low oil bleeding formulation minimises contamination of electronic contacts and components while maintaining thermal and mechanical performance over time. The supplied size 20 x 70 x 1.75 mm fits a variety of small form-factor applications.

Suitable for

• Heat dissipation on M.2 modules and SSDs
• Thermal interface in compact computer components
• Filling gaps between heatsinks and electronic components

Key specifications

• Brand: DELOCK
• Model / MPN: 18467
• EAN: 4043619184675
• Thermal conductivity: 3.2 W/m·K
• Dimensions: 20 x 70 x 1.75 mm
• Color: Grey
• Package: Polybag
• Category: Computer components accessories

How to use

Clean contact surfaces to remove dust, grease or old thermal material. Cut the pad to the required shape and size if necessary, then place it between the heat-generating component (for example an M.2 module) and the heatsink or metal contact. Ensure even contact and avoid trapping air pockets. Reassemble the device following the manufacturer’s instructions and verify fit before powering the system.

Recommendations

Store the thermal pad in a cool, dry place and avoid prolonged exposure to direct sunlight. For best results, check compatibility with the device’s clearances and mounting pressure; replace the pad if it appears compressed or damaged.