Θερμοαγώγιμη πάστα Prolimatech PK-3 30 g 11,2 W/m·K

Prolimatech PK-3 30g is a high-performance thermal compound formulated to improve heat transfer between processors or graphics chips and their heatsinks. With a specified thermal conductivity of 11.2 W/m·K and a 30 g tube, this thermal paste is intended for use where consistent thermal interface material is required to reduce thermal resistance at microscopic contact points.

Advantages

PK-3 uses engineered nano particles to fill microscopic gaps between the CPU/GPU surface and heatsink base, reducing trapped air and improving thermal contact. The compound's rated thermal conductivity of 11.2 W/m·K characterizes its capability to conduct heat away from components more efficiently than conventional pastes. The 30 g weight provides enough material for multiple applications or for servicing several systems.

Suitable for

• Applying between CPUs and heatsinks in desktop and workstation systems
• Use on GPUs where direct-die or IHS contact requires improved thermal transfer
• Reapplying thermal interface material during routine maintenance or cooling upgrades

Key specifications

• Thermal conductivity: 11.2 W/m·K
• Net weight: 30 g (0.03 kg)
• Form: thermal compound paste designed for filling microscopic surface imperfections

How to use

Prepare the surfaces by removing old thermal compound and cleaning the CPU/GPU heatspreader and heatsink base with isopropyl alcohol until dry. Apply a small, even amount of PK-3 to the center of the chip or follow the manufacturer-recommended application pattern for your cooler. Mount the heatsink with even pressure so the paste spreads and fills micro-gaps; avoid excessive application as surplus can reduce effectiveness. After installation, monitor temperatures to verify correct seating and thermal performance.

Recommendations

Use gloves or a clean tool to apply the compound and store the tube capped in a cool, dry place when not in use. Replace thermal compound whenever the cooler is removed or if thermal performance degrades over time.