Ψύκτρα Thermaltake Toughair 310

The Thermaltake Toughair 310 is a single-tower CPU air cooler that combines a newly designed heatsink with an optimized 120 mm high static pressure fan. It uses four 6 mm U‑shape copper heat pipes that make direct contact with the CPU, and an asymmetric fin structure to improve airflow and heat dissipation while supporting thermal loads up to 170 W. The cooler measures 71.7 mm (W) × 123.6 mm (D) × 159.5 mm (H) and is finished in black and silver.

Advantages

The Toughair 310’s single-tower layout and U‑shaped heat pipes create effective heat circulation for consistent CPU cooling. Its enhanced 120 mm fan runs up to 2000 RPM and provides high static pressure for better airflow through the fins. The asymmetric fin design reduces turbulence and directs air more efficiently through the heatsink, improving overall cooling performance without increasing radiator size.

Suitable for

• Air cooling of mainstream desktop CPUs with up to 170 W TDP
• Systems requiring a compact tower cooler that fits most mid‑tower cases
• Builds using Intel LGA and AMD AM4/AM3+/AM3/AM2+/AM2/FM2/FM1 sockets

Key specifications

• Fan diameter: 120 mm
• Fan speed: 500–2000 RPM
• Max air pressure: 2.41 mmH2O
• Heat pipes: 4 × Ø6 mm U‑shape copper pipes
• Supported socket compatibility: Intel LGA 1200/1156/1155/1151/1150; AMD AM4/AM3+/AM3/AM2+/AM2/FM2/FM1
• Dimensions (W × D × H): 71.7 × 123.6 × 159.5 mm
• Color: Black, Silver

How to use

Install the Toughair 310 on a clean CPU surface following the motherboard socket‑specific mounting instructions included with the product. Apply an appropriate amount of thermal paste between the CPU and the cooler base, position the cooler so the heat pipes make full contact with the CPU, and fasten the mounting bracket evenly. Connect the fan to the CPU fan header on the motherboard and configure fan curves in the BIOS or software as needed.

Recommendations

For optimal results, ensure sufficient case airflow by maintaining at least one intake and one exhaust fan. Use a thin, even layer of quality thermal paste, and confirm clearance for RAM modules and tall VRM heatsinks before final installation.