Ψύκτρα CPU Akasa Al LGA1700 για Thin Mini-ITX — επίπεδη ψύκτρα αλουμινίου

Akasa Al LGA1700 for Thin Mini-ITX is a low-profile aluminium CPU heatsink engineered for compact desktop and small-form-factor builds that use Intel LGA1700 socket motherboards. The slim passive-style design offers effective heat dissipation in systems with restricted height and airflow, and it supports quiet operation when combined with low-RPM fans. Its aluminium construction focuses on lightweight thermal conduction and compatibility with Thin Mini-ITX mounting layouts.

Advantages

The low-profile aluminium design reduces overall cooler height to fit under low-clearance cases and chassis panels, while providing broad base contact for heat transfer. Passive cooling capability makes it suitable for fanless or near-silent systems; when paired with a small low-noise fan it supports improved thermal performance without a significant increase in acoustic output. The unit is tailored for LGA1700 mounting patterns used in Thin Mini-ITX motherboards, simplifying installation in constrained builds.

Suitable for

• Thin Mini-ITX desktop and small-form-factor PC builds with LGA1700 socket
• Systems with limited internal height or low-clearance cases
• Quiet or near-silent office and HTPC environments requiring passive or low-noise cooling
• Light to moderate CPU workloads where a slim aluminium heatsink provides adequate dissipation

Key specifications

• Cooling type: Low-profile aluminium heatsink for CPU cooling
• Socket compatibility: LGA1700 mounting format (Thin Mini-ITX layouts)
• Form factor: Slim, passive-style profile suitable for low-clearance chassis
• Material: Aluminium construction for lightweight thermal conduction
• Cooling mode: Passive operation or low-noise active when paired with compatible fan

How to use

Install the heatsink onto an LGA1700 Thin Mini-ITX motherboard following the motherboard and chassis instructions for low-profile coolers. Clean the CPU heatspreader surface, apply a thin, even layer of thermal compound, align the heatsink base with the CPU, and secure it with the mounting hardware appropriate for the Thin Mini-ITX layout. If active cooling is required, mount a compatible low-profile fan oriented to maintain airflow within the chassis and connect it to the motherboard fan header. Verify clearance with DIMM modules, case panels, and adjacent components before final assembly.