Μονάδα πομποδέκτη SFP BlueOptics SFP100FX1310-TSC-20KM-BO 155 Mbit/s

The BlueOptics SFP100FX1310-TSC-20KM-BO is a single-mode fiber SFP transceiver module designed for reliable optical network links with a maximum data transfer rate of 155 Mbit/s and a maximum transmission distance of up to 20 km. Housed in an aluminium case and weighing approximately 20 g, the module features an LC duplex optical interface and complies with MSA form-factor expectations for hot-pluggable SFP modules. It supports 1310 nm transmission and reception for point-to-point fiber connections where electromagnetic immunity and long-distance reach are required.

Advantages

The module provides stable fiber connectivity for Ethernet and other 155 Mbit/s-compatible protocols over single-mode fiber, combining a compact aluminium housing with a lightweight design that facilitates installation in switches, routers and media converters. Its MSA-compliant SFP form factor and LC duplex connector enable broad compatibility with devices that accept standard SFP transceivers. The product’s construction and component selection are intended to support long service life and dependable operation in typical network environments.

Suitable for

Key specifications

How to use

Insert the transceiver into an SFP slot of a compatible switch, router or media converter while the host device is powered on or off as supported by the equipment. Connect a single‑mode LC duplex patch cable to the module’s optical ports, ensuring correct transmit/receive orientation. Configure the network device if necessary for the corresponding 100BASE‑LX or 155 Mbit/s link settings and verify the link status through the host device interface. Follow the host equipment documentation for any required firmware or compatibility settings.

Recommendations

Use single‑mode fiber patch cords and maintain clean LC connector endfaces to ensure optimal signal quality. Verify that the host hardware supports SFP transceivers with the specified wavelength and data rate. Store spare transceivers in anti‑static packaging and avoid exposing the module to excessive mechanical stress or contamination.