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I/O-Blende Supermicro MCP-260-00070-1N

I/O-Blende Supermicro MCP-260-00070-1N
I/O-Blende Supermicro MCP-260-00070-1N
23,65 €
The Supermicro MCP-260-00070-1N I/O shield is designed to fit X11SSV-Q series motherboards, providing precise alignment and physical protection for rear-panel connectors. Finished in durable grey, the shield secures ports in the case opening, helps prevent dust and foreign object intrusion, and cont... Περισσότερα
Απόθεμα 2 Κωδικός 1449501 Μάρκα SUPERMICRO Μοντέλο MCP-260-00070-1N Εγγύηση 2 χρόνια

Αποστολή & επιστροφές

Εκτιμώμενη παράδοση Δευτέρα, Οκτωβρίου 19
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The Supermicro MCP-260-00070-1N I/O shield is designed to fit X11SSV-Q series motherboards, providing precise alignment and physical protection for rear-panel connectors. Finished in durable grey, the shield secures ports in the case opening, helps prevent dust and foreign object intrusion, and contributes to a tidy rear appearance. It also supports electromagnetic compatibility by forming a conductive boundary between the motherboard backplane and the chassis.

Advantages

This I/O shield offers a secure, form-fitting installation that reduces connector stress and ensures accurate port alignment. The grey finish resists corrosion and maintains a consistent look with many server and workstation chassis. By completing the motherboard-to-chassis interface, the shield helps reduce electromagnetic interference (EMI) and improves airflow management at the rear of the case.

Key specifications

  • Compatibility: rear I/O layout matched to X11SSV-Q motherboards
  • Finish: durable grey coating for corrosion resistance
  • Function: physical port alignment, dust protection, and EMI shielding
  • Form factor: standard single-slot I/O shield size for ATX-style rear openings
  • Material characteristics: conductive metal construction with grounding points

How to use

Align the I/O shield with the rear opening of the computer case so that each cutout corresponds to the motherboard ports. Press the shield firmly into the case opening until its edges snap into place and the grounding tabs contact the case. After securing the motherboard in the case, verify that all ports are accessible and properly seated against the shield. If removal is required, gently pry the shield from one corner and lift it out to avoid bending tabs.

Recommendations

Install the shield prior to seating the motherboard to ensure correct alignment and to avoid damaging port pins. Ensure contact between the shield grounding points and the chassis for proper EMI performance. Handle with care to prevent sharp edges from causing injury and to maintain the integrity of the shield's tabs and cutouts.

Κύρια σημεία
  • Сборка и модернизация систем на базе материнской платы X11SSV-Q
  • Серверные и рабочие станции с совместимым расположением портов
  • Сборки, где требуется дополнительная защита разъемов от пыли и электромагнитных помех
  • Compatibility: rear I/O layout matched to X11SSV-Q motherboards
  • Finish: durable grey coating for corrosion resistance
  • Function: physical port alignment, dust protection, and EMI shielding
  • Form factor: standard single-slot I/O shield size for ATX-style rear openings
  • Material characteristics: conductive metal construction with grounding points
Χαρακτηριστικά
Πιστοποιητικά συμμόρφωσης
RoHS
Συμβατά προϊόντα
X11SSV-Q
Τύπος
I/O shield
Χρώμα προϊόντος
Grey
Ιστορικό τιμών τους τελευταίους 6 μήνες
I/O-Blende Supermicro MCP-260-00070-1N
Τρέχουσα
23,65 €
Χαμηλότερη
22,92 €
Υψηλότερη
41,03 €
Μεταβολή 24 ωρών
+0,65 €   +3%
Εβδομάδα
+0,61 €   +3%
Μήνας
+0,64 €   +3%

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