Θερμοαγώγιμο pad Gelid Solutions TP-GP04-R-D πυκνότητα 3,2 g/cm³ πλάτος 120 mm

The Gelid Solutions GP-Ultimate 120×20 thermal pad provides a stable thermal interface for transferring heat from high-temperature SMD components to heatsinks on PCBs with height differences and uneven surfaces. With a multilayer matrix and material composition optimized for heat transfer, this thermal pad delivers a rated thermal conductivity of 15 W/mK and is supplied in a 120 × 20 mm format suitable for larger surfaces such as RAM modules, GPU and CPU VRM areas, M.2 SSDs and other densely packed electronic assemblies.

Advantages

The GP-Ultimate 120×20 is electrically non-conductive, non-corrosive, non-curing and non-toxic, supporting an extended operating temperature range from -60°C to 220°C. Its enhanced multilayer structure and 15 W/mK thermal conductivity enable efficient heat transfer across uneven gaps, while the 120 × 20 mm dimensions allow coverage of enlarged component surfaces for reliable thermal coupling.

Suitable for

• DRAM ICs and RAM memory modules
• VRM ICs and CPU/GPU voltage regulation circuits
• Power MOSFETs and other high-temperature SMD components
• M.2 SSDs and compact storage modules
• General PCB areas with height differences and uneven surfaces

Key specifications

• Thermal conductivity: 15 W/mK
• Density: 3.2 g/cm³
• Dimensions: 120 × 20 mm (thickness specified in product data: 2 mm)
• Operating temperature range: -60°C to 220°C
• Material properties: non-electrically conductive, non-corrosive, non-curing, non-toxic

How to use

Cut the thermal pad to the required shape if necessary and place it between the heatsink and the component surface, ensuring full contact with both surfaces. Align the pad to cover the target area, then apply moderate pressure to seat it and remove air gaps for optimal thermal transfer. No curing or additional adhesives are required; ensure surfaces are clean and dry before installation.

Recommendations

For best results, select a pad thickness that matches the gap between component and heatsink. Avoid stretching the pad during installation and replace the pad if it becomes damaged or contaminated. Verify compatibility with component clearance and mounting mechanisms prior to fitting.