Θερμοαγώγιμη πάστα Cooler Master CRYONAMICS TPY-ADPG-3040-R1 4 g

Thermal paste Cooler Master CRYONAMICS TPY-ADPG-3040-R1 4 g is a thermally conductive interface material designed to improve heat transfer between processors, graphics chips and their cooling solutions. Supplied in a 4 gram syringe, the compound fills microscopic gaps and surface irregularities to facilitate efficient conduction of heat from the CPU or GPU to air or liquid coolers. The paste is formulated for desktop systems and small electronics where controlled application and reliable thermal performance are required.

Advantages

The compound offers high thermal conductivity and stable viscosity for consistent spreading during application, minimizing air pockets that reduce cooling efficiency. Its non-conductive base reduces the risk of electrical shorting near fine-pitch components, and the 4 g volume provides enough material for multiple applications or for reworking a single system several times. The syringe delivery allows precise dispensing and easier control when applying a thin, even layer.

Suitable for (tasks / use cases)

• Desktop CPU-to-heatsink interface
• GPU cooler reapplications and maintenance
• Small form-factor PCs and compact electronics requiring thermal gap filling
• Overclocking and sustained high-load scenarios where improved heat transfer is needed

Key specifications

• Net weight: 4 g syringe suitable for multiple applications
• Form: viscous paste for gap filling and surface contact
• Electrical properties: non-conductive formulation to reduce short-circuit risk
• Compatibility: suitable for CPU, GPU and general electronic components that require thermal interface material
• Application temperature range: formulated to remain stable under typical processor operating temperatures

How to use

Prepare surfaces by powering off the system and removing the cooler. Clean existing thermal material from both the processor surface and cooler base using isopropyl alcohol and a lint-free cloth. Apply a small, pea-sized amount of paste to the centre of the processor or follow the cooler manufacturer’s recommended pattern. Reattach the cooler and secure it with even pressure to spread the paste into a thin, uniform layer. If reapplying, remove old residue thoroughly before applying a fresh layer.

Recommendations

Apply a thin, even layer; excessive paste can reduce thermal performance. Store the syringe in a cool, dry place and keep the cap on to prevent drying. Allow the thermal paste to settle after initial operation and check temperatures under load to confirm improved heat transfer.