Team Group Team Elite - DDR3L - μονάδα - 4 GB - SO DIMM 204-PIN

The Team Group 4GB DDR3L SO-DIMM memory module is a compact laptop memory upgrade that provides 4 GB of additional system memory at a 1600 MHz clock rate. Designed for notebooks and small-form-factor systems that accept 204-pin SO-DIMM modules, this DDR3L module operates at a reduced voltage for improved energy efficiency while maintaining compatibility with many existing DDR3 platforms that support low-voltage memory.

Advantages

This 4 GB DDR3L SO-DIMM balances performance and power consumption by using low-voltage DDR3L technology and a 1600 MHz data rate. The module’s 204-pin SO-DIMM form factor ensures compatibility with a wide range of laptops and compact PCs. Its modest capacity is suitable for light multitasking and system responsiveness improvements over lower-memory configurations, while the 1.35 V operation helps reduce battery draw in portable systems.

Suitable for

• Upgrading laptop memory to improve system responsiveness
• Replacing a faulty or missing SO-DIMM module in notebooks
• Adding memory to small-form-factor PCs that use 204-pin SO-DIMM
• Systems requiring low-voltage (1.35 V) DDR3L modules

Key specifications

• Capacity: 4 GB
• Memory type: DDR3L (low-voltage DDR3)
• Form factor: 204-pin SO-DIMM
• Clock speed: 1600 MHz
• Operating voltage: 1.35 V

How to use

Power off the laptop and disconnect any external power sources and batteries if removable. Open the memory compartment or access panel according to the device manufacturer’s instructions. Align the 204-pin SO-DIMM notch with the slot and insert the module at a slight angle, then press down until the side clips engage and secure the module. Reassemble the device, reconnect power, and start the system. Verify that the operating system recognizes the additional 4 GB of memory through system settings or BIOS/UEFI.

Recommendations

Before installation, consult the laptop or motherboard manual to confirm support for DDR3L modules and any maximum memory capacity or slot pairing requirements. When mixing memory modules, aim to match speed and voltage characteristics to avoid compatibility issues and to enable dual-channel operation where supported. Handle the module by its edges and avoid contact with the gold connector pins to prevent damage from static discharge or oils.